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. Such growth can be as much as several microns during reflow. Therefore it is imperative that liquidus dwell time -the interval that the interconnection is above the melting temperature of the solder alloy, be kept as short as possible
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. Cool solder -- peak temperature is too low or time too short The peak temperature should be 20~25°C higher than the solder liquid point and remains there for 30~90 seconds. Cooling zone (below 217~220°C after reflow
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. What Is Surface Mount Technology Surface Mount Technology (SMT) involves mounting and soldering electronic components that either have short pins/leads, or none at all, onto the surface of a PCB
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