| http://www.feedersupplier.com/sale-13118500-fuji-xpf-l-electronics-8mm-12mmtape-smt-pick-and-place-machine.html
(MTU-All) 20 Trays + 20 Feeders 7x Single Nozzles Automatic backup Pins Head Configuration: Chip Shooter Head (12 Nozzles Revolver Auto Tool
| http://www.feedersupplier.com/sale-13118511-fuji-xpf-l-25000-cph-20-feeders-smt-pick-and-place-machine.html
(MTU-All) o 20 Trays + 20 Feeders o 7x Single Nozzles • Automatic backup Pins - Head Configuration: •Chip Shooter Head (12 Nozzles Revolver Auto Tool
| http://etasmt.com:9060/te_news_bulletin/2021-09-03/25562.chtml
: 20-200 cm/min Pin-and-chain conveyor with 3, 4 or 5 mm pins Process zone Process length: 3,790 mm Heated length: 2,650 mm Cooling length
| http://etasmt.com:9060/te_news_industry/2019-06-13/6961.chtml
: printing solder paste>mounting components>reflow soldering>inspection ❙ 2. Wave soldering machine : The pump is used to spray the molten solder into solder peaks, and then the pins of the electronic components to be soldered are passed through the solder peaks to electrically interconnect the
| http://etasmt.com/te_news_industry/2019-06-13/6961.chtml
: printing solder paste>mounting components>reflow soldering>inspection ❙ 2. Wave soldering machine : The pump is used to spray the molten solder into solder peaks, and then the pins of the electronic components to be soldered are passed through the solder peaks to electrically interconnect the
| http://etasmt.com/te_news_bulletin/2020-02-20/14161.chtml
. When the component placement position is deviated, due to the surface tension of the molten solder, when all solder ends or pins are wetted at the same time as the corresponding pads, the surface is
| http://etasmt.com/te_news_bulletin/2021-09-03/25562.chtml
: 20-200 cm/min Pin-and-chain conveyor with 3, 4 or 5 mm pins Process zone Process length: 3,790 mm Heated length: 2,650 mm Cooling length
| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml
. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
| http://etasmt.com/te_news_bulletin/2020-12-18/21361.chtml
. As the temperature increases further, the surface tension of the solder decreases. The solder climbs to a certain height of the component pins. 4
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/about/blog/material-management-under-control
für kleinere Komponenten an, was machen sie mit ungeraden Formen oder Multi-Pins, sind alle Prüfalgorithmen in der Software enthalten oder
