| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
? Did the wire break at the weld? Did the plating come off the board? We need to define what kind of gold plating is on the board. Is it Electroplated Gold? Is it ENIG
| https://www.eptac.com/faqs/soldertips?hsLang=en
. Read More Gold Removal Issues with Hollow Cup Connectors General Tip Question: We are having a hard time with the removal of gold from hollow cup connectors
| https://www.eptac.com/faqs/soldertips
. Read More Gold Removal Issues with Hollow Cup Connectors General Tip Question: We are having a hard time with the removal of gold from hollow cup connectors
| https://www.eptac.com/solder-tips/
. Read Answer Gold Removal Issues with Hollow Cup Connectors Question: We are having a hard time with the removal of gold from hollow cup connectors
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. For example, electroless nickel immersion gold (ENIG) is a common surface finish due to its long shelf life and RoHS compliance . However, it’s more expensive than other options
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
) and Gold Embrittlement Conditions David Hillman and Daphne Gates Abstract 32-3 Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
reference [7], an optimum gold thickness was determined. At the low end, the gaps in the plating resulted in voiding. At the high end, excess IMC growth occurred during reflow and reliability testing. The bondline thickness (BLT) of indium solder preforms is
