ASCEN Technology | https://www.ascen.ltd/Products/auto_optical_inspection/517.html
. A500 model is able to test HASL and red glue efficiently to improve solder image quality of after reflow and inspection results. It helps to solve the solder joints problems caused by PCB with different background
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
), and then allowed to stabilize for 5 minutes. All boards were visually inspected after stencil printing, after pick and place, and after reflow
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
), and then allowed to stabilize for 5 minutes. All boards were visually inspected after stencil printing, after pick and place, and after reflow
ASCEN Technology | https://www.ascen.ltd/Products/auto_optical_inspection/515.html
. A500 model is able to test HASL and red glue efficiently to improve solder image quality of after reflow and inspection results. It helps to solve the solder joints problems caused by PCB with different background
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-industry-trends-that-matter-in-2022/
. Lead hot air solder leveling, or HASL, used to be one of only two ways that printed circuit boards could be finished. Now, dozens of options are available with affordable prices, good handling sensitivity, and long-lasting shelf life
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Abstract 32-2 The Study of Dissolution of Bi Precipitates in Sn Using a Novel In Situ Heating Technique in the SEM Peter Banh, André M. Delhaise, Doug D. Perovic Abstract 32-2 Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage, Part I
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
side reflow Ensure a robust surface finish that remains solderable after 2 heat cycles. In circuit test strain limits could be larger with thicker boards. ICT stress must be minimal to prevent BGA fracture Ensure low contact resistance on test points
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