Imagineering, Inc. | https://www.pcbnet.com/quote/assembly-quote/?cpn=0
* Select One 1 2 3 4 5 6 8 Dimensions * Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" (Immersion Gold) ENIG2U" (Immersion Gold) ENIG3U" (Immersion Gold) ENIG4U" (Immersion Gold) ENIG5U" (Immersion Gold
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-china/
* Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" (Immersion Gold) ENIG2U" (Immersion Gold) ENIG3U" (Immersion Gold) ENIG4U" (Immersion Gold) ENIG5U" (Immersion Gold) Immersion Tin Immersion Silver HASL
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=2
) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=3
. PCB Specifications View Matrix Part Number * Revision Quantity * Thickness 0.062" Layers * Select One 2 4 6 8 Dimensions * Materials FR4(130Tg) FR4(180Tg) from Taiwan or China Copper Weight 1 oz 4 oz Cu from Taiwan or China Finish Plating HASL
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=2
* Select One 1 2 3 4 5 6 8 Dimensions * Materials FR4(130Tg) FR4(170Tg) FR4(180Tg) from Taiwan or China Copper Weight 1 oz 2 oz 3 oz 4 oz Cu from Taiwan or China Finish Plating ENIG1U" (Immersion Gold) HASL (Leaded
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=5
* Materials FR4(130Tg) FR4(170Tg) FR4(180Tg) from Taiwan or China Copper Weight 1 oz 2 oz 3 oz 4 oz Cu from Taiwan or China Finish Plating ENIG1U" (Immersion Gold) HASL (Leaded
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
. May require more aggressive Flux and/or No lead HASL finish • Drop in process for existing reflow equipment • Nitrogen cover gas will enhance wetting and appearance, but is not essential for adequate results
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
. May require more aggressive Flux and/or No lead HASL finish • Drop in process for existing reflow equipment • Nitrogen cover gas will enhance wetting and appearance, but is not essential for adequate results
| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. The surface finish is not exposed. Dewetting usually refers to alloy solder joints that are not extended to PCB pads, so they do not obtain a good solder joint fillet
Heller Industries Inc. | https://hellerindustries.com/dull-solder-joints/
. Process and design-related causes of Dull Solder Joints: Impurity in the component plating Impurity in the circuit board finish Bad or expired solder paste Reflow-related causes of dull solder joints
