Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
Procured test board with bare copper pads protected with OSP. (Future testing to be run with HASL Lead Free Pads) ♦ Tested 2 pastes: ♦ 96.5% Sn/3.5% Ag with RMA flux melt point 221
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
Procured test board with bare copper pads protected with OSP. (Future testing to be run with HASL Lead Free Pads) ♦ Tested 2 pastes: ♦ 96.5% Sn/3.5% Ag with RMA flux melt point 221
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
copper/intermetallic interface without any signs of grain boundary attack was detected. The mechanisms themselves occur in series and the slowest one determines the overall kinetics of the process. The most general dissolution rate equation is shown below8
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
-1 Alternatives to Solder in Interconnect, Packaging, and Assembly Herbert J. Neuhaus, Ph.D., and Charles E. Bauer, Ph.D. Abstract 2012 25-4 Should Intermetallic Thickness Measurements Be Needed To Determine Solder Joint Reliability Scott K Buttars
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