Partner Websites: hasl intermetallic layer (Page 1 of 5)

Intermetallic Growth on PCB - Heller

Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth/

). Over time, an intermetallic layer grows. The speed at which it grows is governed by the thermal excursions as well as the ambient temperature

Heller Industries Inc.

Intermetallic Growth on PCB - Heller

Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth

). Over time, an intermetallic layer grows. The speed at which it grows is governed by the thermal excursions as well as the ambient temperature

Heller Industries Inc.

Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print

).   Over time, an intermetallic layer grows. The speed at which it grows is governed by the thermal excursions as well as the ambient temperature

Auction - Multi-Layer Technologies | The Branford Group

| http://www.thebranfordgroup.com/dnn3/Auction/MULA0623.aspx

Auction - Multi-Layer Technologies | The Branford Group Sign Up For Our Auction Email Alerts!         Home Auctions Upcoming Auctions Recent Auctions Asset Recovery Programs Industry Expertise Logistics

Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23575.chtml

).   Over time, an intermetallic layer grows. The speed at which it grows is governed by the thermal excursions as well as the ambient temperature

Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2021-08-31/23575.chtml

).   Over time, an intermetallic layer grows. The speed at which it grows is governed by the thermal excursions as well as the ambient temperature

PCB Assembly Technology Roadmap | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/

• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control

Imagineering, Inc.

PCB Fabrication Technology Roadmap | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/

• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control

Imagineering, Inc.

Leadfree

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf

°C N2 Good Wetting with Grainy Surface Finish PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 11 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 3 Thin Intermetallic Layer No Voids BGA Cross Section Material

Heller Industries Inc.

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