Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth/
). Over time, an intermetallic layer grows. The speed at which it grows is governed by the thermal excursions as well as the ambient temperature
Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth
). Over time, an intermetallic layer grows. The speed at which it grows is governed by the thermal excursions as well as the ambient temperature
| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print
). Over time, an intermetallic layer grows. The speed at which it grows is governed by the thermal excursions as well as the ambient temperature
| http://www.thebranfordgroup.com/dnn3/Auction/MULA0623.aspx
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| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23575.chtml
). Over time, an intermetallic layer grows. The speed at which it grows is governed by the thermal excursions as well as the ambient temperature
| http://etasmt.com/te_news_bulletin/2021-08-31/23575.chtml
). Over time, an intermetallic layer grows. The speed at which it grows is governed by the thermal excursions as well as the ambient temperature
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
°C N2 Good Wetting with Grainy Surface Finish PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 11 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 3 Thin Intermetallic Layer No Voids BGA Cross Section Material