24 hasl vs. enig results

PCB Fabrication Technology Roadmap | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/

• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control

Imagineering, Inc.

#1 Evaluation Parameters  Boards, HASL and OSP  Components, Tin and Tin/Lead  Solder, SAC 305 and Tin/Lead Investigation of the Forward and Backward Compatibility of Solder Alloys With Component Finishes for HASL and OSP PCB Finish, Anand Kannabiran, Elavarasan T

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf

. Original circuits were HASL, new products have ENIG Question: •  Will this create any gold embrittlement with the use of ENIG? 2 Question #1 •  From IPC 6012 Table 3-2 Final Finish and Coating Requirements, the parameters for ENIG coating is as shown

| https://www.eptac.com/wp-content/uploads/2016/08/eptac_08_17_16.pdf

. Original circuits were HASL, new products have ENIG Question: •  Will this create any gold embrittlement with the use of ENIG? 2 Question #1 •  From IPC 6012 Table 3-2 Final Finish and Coating Requirements, the parameters for ENIG coating is as shown

| https://www.eptac.com/wp-content/uploads/2021/11/eptac_08_17_16.pdf

PCB Assembly Tolerances | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/tolerances/

. They provide enough variation for us to assemble your board – and for it to work properly in your application. Supported PC Board Specs: Min size:  1.967 in. X 1.967 in. Max size:  19.67 in. X 19.67 in. Min thickness:  4 mil Max thickness:  240 mil Layer Count:  Up to 24 Finishes:  HASL, ENIG, Silver

Imagineering, Inc.

SMT Processes Re-Certification

Surface Mount Technology Association (SMTA) | https://www.smta.org/certification/recertification.cfm

. James Hall are divided into 11 modules each with slides and a quiz on the following updated topics: PCB Basics and Surface Finishes like HASL and ENIG Surface Finishes like OSP, Immersion Tin, Immersion Silver Paste, stencils, printing and how they are interrelated Component placement with a focus

Surface Mount Technology Association (SMTA)

Solder Selection for Printed Circuit Boards and Terminals - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals

? My second question is what kind of solder would you suggest for doing repair or adding a component to a surface mount board? Answer: The type of flux to be used is determined by the surfaces being soldered, such as HASL, OSP, ENIG, Gold, Pd, etc

Solder Selection for Printed Circuit Boards and Terminals - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/solder-selection-for-printed-circuit-boards-and-terminals/

? My second question is what kind of solder would you suggest for doing repair or adding a component to a surface mount board? Answer: The type of flux to be used is determined by the surfaces being soldered, such as HASL, OSP, ENIG, Gold, Pd, etc

Leadfree

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf

, °C ALLOY COMPOSITION, wt% PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 4 of 24 Rev Level: 1 Rev Date: 1/03/01 Eutectic Vs. Lead Free Process window comparison Conclusions

Heller Industries Inc.

Leadfree

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf

, °C ALLOY COMPOSITION, wt% PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 4 of 24 Rev Level: 1 Rev Date: 1/03/01 Eutectic Vs. Lead Free Process window comparison Conclusions

Heller Industries Inc.