| http://etasmt.com/cc?ID=te_news_industry,23961&url=_print
High Speed High Density Open Pin Field Array, has up to 500 I/O contact pins with a solder charge termination. This type of connector looks like a standard BGA type of SMT device
| http://etasmt.com:9060/te_news_industry/2021-08-31/23961.chtml
.050" SEARAY™ High Speed High Density Open Pin Field Array, has up to 500 I/O contact pins with a solder charge termination. This type of connector looks like a standard BGA type of SMT device
| http://etasmt.com/te_news_industry/2021-08-31/23961.chtml
.050" SEARAY™ High Speed High Density Open Pin Field Array, has up to 500 I/O contact pins with a solder charge termination. This type of connector looks like a standard BGA type of SMT device
Imagineering, Inc. | https://www.pcbnet.com/blog/high-temperature-pcb-considerations-for-high-heat-applications/
. The demands of high power-density designs have eclipsed traditional PCB heat-management practices. How are today’s PCB manufacturers finding ways to keep machines functioning even in the most inhospitable environments
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/footprints-for-high-vibration-and-shock_topic2568_post10485.html
: San Diego, CA Status: Offline Points: 5131 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 06 Nov 2019 at 7:03am Originally, the IPC-7351 Most Density was the solution for high shock and vibration, but 8 years ago the Japanese did tests on the Nominal and Most Density Levels and discovered that there was no
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/footprints-for-high-vibration-and-shock_topic2568_post10481.html
: San Diego, CA Status: Offline Points: 5184 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 06 Nov 2019 at 7:03am Originally, the IPC-7351 Most Density was the solution for high shock and vibration, but 8 years ago the Japanese did tests on the Nominal and Most Density Levels and discovered that there was no
ORION Industries | http://orionindustries.com/pdfs/200mp.pdf
. Relative High Temperature Operating Ranges Short term (minutes/hours) 400°F (204°C) Long term (days/weeks) 300°F (149°C) IV. Static Shear ASTM D3654 - 1" x 1" sample area - aluminum foil to stainless steel Minutes to Failure Temperature Load 2 mil 5 mil 70°F
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/news/nordson-asymtek-demonstrations-drove-success-at-nepcon-south-china-2014
. Jetting deposited the solder paste in recessed areas on the printed circuit board and produced small keep-out-zones (KOZs) to accommodate high-density packages
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296
Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys 中文 MEMBERS LOGIN Membership Become a Member! Renew Membership About SMTA Ambassadors Benefits Classifications Member Directory Member Directory Corporate Suppliers Corporate Users Consultants List Advertisers Update Your Info
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/solutions/semiconductor-packaging
. Small, high-density semiconductor integrated-chip (IC) packaging, such as ball-grid arrays (BGAs), has gained widespread developer acceptance because it enables increased device performance and printed circuit board (PCB
