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Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing - 电子邮件: jchen@hellerindustries.com.cn 电话: +86-21-64426180 公司 关于 新闻 事件 新设备 回流焊炉 双轨/双温度控制 固化和后端半导体 零空洞/真空炉 无助焊剂/酸性
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Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing - Heller Industries Home
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Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing - Heller Industries » 海勒工业公司宣布与IBM签订用于大批量生产的无焊剂大规模回流焊接工艺的联合开发协议 海勒工业公司宣布与IBM签订用于大批量生产的无焊剂大规模回流焊接工艺的联合开发协议 新泽西州弗洛
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Used Reflow Oven For High Volume PCB Assembly - Heller Home » Used Reflow Oven For High Volume PCB Assembly Used 1912EXL Reflow Oven Reflow Oven Model: 1912EXL DOM
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Used Reflow Oven For High Volume PCB Assembly - Heller Home » Used Reflow Oven For High Volume PCB Assembly Used 1912EXL Reflow Oven Reflow Oven Model: 1912EXL DOM
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KingFei SMT Tech | https://www.smtspare-parts.com/sale-11739050-high-speed-surface-mount-placement-machine-fuji-scalable-placement-platform-nxt.html
High Speed Surface Mount Placement Machine Fuji Scalable Placement Platform NXT Ⅲ Leave a Message We will call you back soon! Your message must be between 20-3,000 characters