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Statement WEEE Contact Global HQ Africa Asia Central and South America Europe USA and Canada High Strain Rate The high strain rate test methodology can be used for both cold bump pull and shear to predict future failures
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(virtually free of vapor inclusions that are commonly found in adhesives produced by the traditional solvent coating technique). Excellent high temperature performance as well as excellent shear strength
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. Precautions for the temperature and humidity sensor in Lyra Reflow Oven. The humidity of the Lyra Reflow Oven environment should not be too high, otherwise the solder paste will absorb moisture from the air and reduce the degree of adhesion, which will directly affect the
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Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/creep-test
. S olders have low melting points. At room temperature, solder behave as other metals would do at high temperature. Large amounts of deformation can occur and under load the material continues to extend
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