ORION Industries | http://orionindustries.com/pdfs/200mp.pdf
successful applications include: materials being bonded, dwell at RT before cold exposure and stress below the TG [i.e. expansion/ contraction stresses, impact]). Optimum conditions are: bonding high surface energy materials, longer time at RT before cold
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/materials-available/
. We typically use Isola and Nanya products, as well as other options right for your project. Our high Tg material is specially formulated for superior performance through multiple thermal excursions, passing 6x solder tests at 288 degrees C
Imagineering, Inc. | https://www.pcbnet.com/blog/when-to-use-fr4-printed-circuit-boards/
150ºC, and also has excellent moisture resistance. High TG FR4 – High TG FR4 is suitable for use in components exposed to higher temperatures
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. Standard PCBs have a Tg of 130˚C, while high-performance boards have a Tg above 170˚C. PCB Material Choices FR-4 is a common choice for PCB substrates since the standard version has a Tg 135˚C
Imagineering, Inc. | https://www.pcbnet.com/blog/selecting-pcb-materials-for-fabrication/
. In high-heat applications, it is essential that a board continues to work without losing functionality. Glass transition temperature (Tg
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_determine-hole-size-for-plastic-peg-alignment-pins_topic720.xml
; PCB Libraries Forum : Questions & Answers : Determine Hole Size for Plastic Peg Alignment Pins Determine Hole Size for Plastic Peg Alignment Pins : The Tg
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-wins-2015-new-product-introduction-award-for-its-flexvia-plus-plasma-treatment-system
. The high-performance desmear and etchback technologies remove epoxies, polyimides, high Tg blends, mixed materials, and other resins while the descum capabilities effectively remove resist residue
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/new-flexvia-plus-plasma-treatment-system-to-process-flexible-electronic-substrates
and desmear process uniformity on both sides of the flex material. The desmear and etchback technologies remove epoxies, polyimides, high Tg blends, mixed materials and other resins more effectively than traditional methods of etching and desmearing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/events/smta-michigan-expo-and-tech-forum-2016
. For example, RoHS requirements have driven printed circuit board assembly materials to ever higher temperature capabilities. The High Tg materials are designed to withstand the higher reflow temperatures of lead free solders but present their own set of problems down the line in subsequent manufacturing steps
.gif)
