GPD Global | https://www.gpd-global.com/co_website/pdf/pbt/PBFT-Strain-Gauge-Retrofit-Procedure-PBT-0110M.pdf
. Pull the Adjustment Screw and Mount Plate away from the front of the PBFT and off the Slide Rods. e. Unscrew the Adjustment Screw and Tape Deflector from the old mount plate and set both items aside
GPD Global | https://www.gpd-global.com/pdf/pbt/PBFT-Strain-Gauge-Retrofit-Procedure-PBT-0110M.pdf
. Pull the Adjustment Screw and Mount Plate away from the front of the PBFT and off the Slide Rods. e. Unscrew the Adjustment Screw and Tape Deflector from the old mount plate and set both items aside
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Packing-Instructions-MAX-Series-Dispenser-22290016.pdf
. For instructions on how to release the Z-axis brake, refer to Step 3 (pg 8). b. Remove the touch probe from the contact surface sensor by grasping the knurled nut at the base of the touch probe and pulling straight downward until both the nut and touch probe pull away from and out of the mount. c
GPD Global | https://www.gpd-global.com/pdf/doc/Packing-Instructions-MAX-Series-Dispenser-22290016.pdf
. For instructions on how to release the Z-axis brake, refer to Step 3 (pg 8). b. Remove the touch probe from the contact surface sensor by grasping the knurled nut at the base of the touch probe and pulling straight downward until both the nut and touch probe pull away from and out of the mount. c
Imagineering, Inc. | https://www.pcbnet.com/blog/considerations-for-pcb-board-design-layout/
. Common errors made during this stage include: Pad size errors – A pad that is too small can have breakout problems for through-hole parts and bad solder joints
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-assembly-how-does-it-work/
. Some things to include are: Mechanical strength Electrical conduction Purity Soldering quality Lamination – Peel and strength Hole wall quality Component polarity, placement, alignment, positioning, etc
| https://www.eptac.com/category/upcoming-webinars/shown.bs.collapse/page/9/
. Then the product information was thrown over the wall and manufacturing was provided with a schedule to build quantities upon quantities of these items
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF9-User-Guide-901-1-07.pdf
. Numerous standard and special CF-9 Lead Forming Die sets are available to provide a variety of component forms and lead configurations. Many different die sets for various transistor hole patterns are also available. A minimal amount of preparation time is
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF9-User-Guide-901-1-07.pdf
. Numerous standard and special CF-9 Lead Forming Die sets are available to provide a variety of component forms and lead configurations. Many different die sets for various transistor hole patterns are also available. A minimal amount of preparation time is
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF9-Doc-Package-901-1-01.pdf
are available to provide a variety of component forms and lead configurations. Many different die sets for various transistor hole patterns are also available. A minimal amount of preparation time is required to reset the machine for processing
