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remove the possibility of the pull hook sliding close to the neck of the bond. Hot Bump Pull Nordson DAGE Nordson DAGE has developed a unique patented technique for attaching a test probe to solder bumps or solder paste in order to perform a hot bump pull test in full accordance with the recently
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. Perform complex automation patterns with our multi-functional cartridge (MFC) that removes the need to change cartridges. Hook and shear tool test positions are also displayed for each interconnect indicating where shear or pull tests will be performed
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test software provides a range of fatigue tests to determine fatigue life. Vector pull Nordson DAGE The vector pull test was initially introduced to apply a programmable angled pull to leads on MBGA devices in order to remove the possibility of the pull hook sliding close
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LED Materials Semiconductor SMD Shear SMT Solar X-ray Technical Papers - Bondtesting Technical Papers - Materials Testing Technical Papers - X-ray Inspection All Downloads Test Types Service
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. Vector pull Nordson DAGE The vector pull test was initially introduced to apply a programmable angled pull to leads on MBGA devices in order to remove the possibility of the pull hook sliding close
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