ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications
Modules Microelectronics - Plastic IC Packaging/PEM Microelectronics - Plastic IC Packaging/PEM/BGA Microelectronics - Printed Circuit Board Microelectronics - Smart Card Microelectronics - Stacked Die
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
Practical Guidelines in Handling Moisture Sensitivity of SMT Packages Mumtaz Bora Free! 2019 Improving Reliability of Assemblies from a Soldering Materials Development Standpoint Shantanu Joshi Free! 2019
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic797&OB=DESC.html
. The Lead Span, Pin Pitch, Pin Qty, Lead Width & Length, Ball Size, Thermal Tab size, Lead tolerance. The only exceptions to this rule is the component Height becasue it affects the 3D model name and BGA because Memory Chips have the same package size for various memory limits, 4GB, 8GB, 16GB, 32GB, etc. i.e
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/multiple-same-footprint-name_topic797_post2903.html
. The Lead Span, Pin Pitch, Pin Qty, Lead Width & Length, Ball Size, Thermal Tab size, Lead tolerance. The only exceptions to this rule is the component Height becasue it affects the 3D model name and BGA because Memory Chips have the same package size for various memory limits, 4GB, 8GB, 16GB, 32GB, etc. i.e
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic797&OB=DESC.html
. The Lead Span, Pin Pitch, Pin Qty, Lead Width & Length, Ball Size, Thermal Tab size, Lead tolerance. The only exceptions to this rule is the component Height becasue it affects the 3D model name and BGA because Memory Chips have the same package size for various memory limits, 4GB, 8GB, 16GB, 32GB, etc. i.e
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/multiple-same-footprint-name_topic797&OB=DESC_page1.html
. The Lead Span, Pin Pitch, Pin Qty, Lead Width & Length, Ball Size, Thermal Tab size, Lead tolerance. The only exceptions to this rule is the component Height becasue it affects the 3D model name and BGA because Memory Chips have the same package size for various memory limits, 4GB, 8GB, 16GB, 32GB, etc. i.e
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
. Klein Wassink, Philips CFT, Holland "The Use of Nitrogen in Reflow Soldering" 1992: John Maxwell, JMA, Colorado "PC Board Design Techniques for Subminiature Chips" 1991: Dr
| 1 |
.gif)
winsouce.jpg)