Blackfox Training Institute, LLC | https://www.blackfox.com/how-to-remove-oxidation-from-soldering-iron-tips/
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/121019-how-to-prevent-air-bubbles-from-causing-piston-bounce
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| https://www.eptac.com/blog/how-ai-development-is-creating-a-new-wave-of-business
How AI Development is Creating a New Wave of Business Looking for solder training standards, manuals, kits, and more? Visit soldertraining.com Training Training Materials Locations Resources Ask Helena
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/062819-how-to-select-the-right-piston-for-your-fluid
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| https://www.eptac.com/soldertip/soldertips-defining-shear-forces-for-surface-mounted-components/
. The DOE modifications could be profile temp changes, paste deposition thickness changes, paste material changes, etc. The reliability of the solder joint is not based upon the how much shear force is required to break the solder joint, but how it is designed for the environment of the operational product
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-defining-shear-forces-for-surface-mounted-components
. The DOE modifications could be profile temp changes, paste deposition thickness changes, paste material changes, etc. The reliability of the solder joint is not based upon the how much shear force is required to break the solder joint, but how it is designed for the environment of the operational product
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
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| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-touching-glass-body-components-like-diodes
the glass body of glass bodied components. There are basically two conditions where solder will touch the glass body, one, too much solder on the pad, and two incorrect pad design
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/how-do-i-make-an-edge-connector_topic1238_post4855.html
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/industries/electronics-assembly-and-packaging/hot-melt-molding?con=t&page=18
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