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| https://www.feedersupplier.com/sale-13118535-siplace-linear-dipping-unit-x-feeder-03063461-siemens-x-pick-and-place-machine-use-smt-feeder-siemen.html
: How about our feeder quality? A: We`ve been doing exportation to Europe and USA for years , quality is the premier factor we concern
| http://www.feedersupplier.com/sale-13118535-siplace-linear-dipping-unit-x-feeder-03063461-siemens-x-pick-and-place-machine-use-smt-feeder-siemen.html
: How about our feeder quality? A: We`ve been doing exportation to Europe and USA for years , quality is the premier factor we concern
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. Circuit board preparation - masking, baking and other process steps. BGA site preparation. Solder mask breakdown - how to prevent it, how to fix it
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Paste Flux Nordson EFD Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus is perfect for BGA rework, mobile device repair, reflowing solder paste, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste?con=t
. Safety Data Sheets Nordson EFD FluxPlus™ Paste Flux Nordson EFD Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus is perfect for BGA rework, mobile device repair, reflowing solder paste, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
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™ Paste Flux Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus is perfect for BGA rework, mobile device