| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly. Note: Gold embrittled solder connections can occur regardless of gold thickness when solder volume is low or the soldering process dwell time is not sufficient to allow the gold to dissolve throughout the
| https://www.eptac.com/soldertip/rechecking-thermal-profiles/
. To verify the board is getting the correct amount of heat to prepare and dry out the solder paste and reflow the solder paste for a long enough dwell time to solder all the components, the thermal
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly. Note: Gold embrittled solder connections can occur regardless of gold thickness when solder volume is low or the soldering process dwell time is not sufficient to allow the gold to dissolve throughout the
| https://www.eptac.com/solder-tips/
. Read Answer SolderTips: How Long Should it Take to Create a Solder Joint Question: Are you aware of any time studies or standards that have been developed to determine the amount of time it should take to create a solder joint while hand soldering, either a through-hole, or surface mount component
| https://www.smtfactory.com/Three-questions-about-PCBA-What-is-the-meaning-of-PCBA-What-is-the-production-equipment-required-for-PCBA-What-is-the-PCBA-production-process-id43571387.html
. Wave Soldering Machine Wave soldering is to make the soldering surface of the plug-in board directly contact with the high temperature liquid tin to achieve the purpose of soldering
| https://www.eptac.com/soldertip/issues-of-burnt-flux-on-class-3-pcb-assemblies/
. These residues are no longer impervious to the environment and pose a reliability problem with the product. Secondly, I’m not sure I fully understand how you are burning the flux as one would have to have an extra long dwell time when making a solder joint to burn the flux, which will definitely impact the laminate in
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
- The importance of controlling moisture levels during BGA reflow, as seen by BGA X-ray inspection. PCB Through Hole Component Quality Soldering Process Improvement of Critical SMT Connectors - Using X-ray inspection and mechanical pull testing to optimize wave soldering process parameters for high density connectors
KingFei SMT Tech | https://www.smtspare-parts.com/sale-11140440-kic-x5-thermal-profiler-with-spc-software-and-rf-capability-for-reflow.html
. Measure slope, peak temperature, time above liquidous, and more. Data is transferred to your computer via a USB cable or, for RF models, wirelessly through radio frequency transmitters
| https://www.smtfactory.com/What-is-the-parameter-debugging-skills-of-the-Full-auto-SMT-Stencil-Printer-id3848478.html
& Nozzle DIP Machine Acrab Series W Series Automatic Insertion Machine Selective Wave Soldering Machine Belt Assembly Line PCB Handling Machine Loaders
| https://www.smtfactory.com/What-are-the-operating-steps-of-the-Full-auto-SMT-Stencil-Printer-id40362477.html
Guide To Selective Soldering Machine Technology Enhancing Electronics Longevity: Dive into The World of PCB Coating Machines for Ultimate Protection Enhancing Reliability in Electronics Manufacturing A Comprehensive Guide To Wave Soldering Machines
