Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/operator/comprehensive-soldering/
, Through Hole and Surface Mount components. This course also covers Fine Pitch Technology and SMT soldering course. Upon successful completion of this training, you will be assured that your workforce has a good understanding of the latest industry workmanship standards, and have learned latest methods to enhance
| https://www.eptac.com/soldertips/soldertip-47-how-long-does-it-take-to-make-a-solder-joint/
SolderTip #47: How Long Does it Take to Make A Solder Joint? | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-47-how-long-does-it-take-to-make-a-solder-joint
SolderTip #47: How Long Does it Take to Make A Solder Joint? - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
? If not, how would we tin the gold plated components by wave soldering? Answer: Soldering gold parts onto printed circuit boards follows Paragraph
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
course, there is no substitute for rigorous process control. However, manufacturers are not without resources to assist in fine-tuning their processes. To take advantage of rapid devel- opments in advanced technology, assemblers should work in partnership
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/00600-248-1.pdf
course, there is no substitute for rigorous process control. However, manufacturers are not without resources to assist in fine-tuning their processes. To take advantage of rapid devel- opments in advanced technology, assemblers should work in partnership
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
), how would you propose we meet the J-STD requirement... Question: Since we are seeing more and more components with gold finish on the solder attachment pads
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. The initial reasoning behind the application of gold to printed circuit boards was to make them more susceptible to the application of wire bonding and for corrosion protection
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements? If not, how would we tin the gold plated components by wave soldering? Answer
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements? If not, how would we tin the gold plated components by wave soldering? Answer