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| http://etasmt.com/te_news_bulletin/2021-08-31/23568.chtml
• Solder paste exposed beyond worklife • Ambient humidity and temperature beyond solder paste work envelope Reflow-related causes
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ORION Industries | http://orionindustries.com/pdfs/200mp.pdf
. In addition, it performs well after exposure to humidity and hot/cold cycles. Provides some initial repositionability when bonding to plastic parts (not metal
| https://www.eptac.com/soldertips/whats-with-the-expiration-dates-on-solder-paste-or-wire/
don’t know the particular environment where the material will be used and things like humidity, size of container and dwell time being exposed on the stencil will affect the functionality of the fluxes
| https://www.eptac.com/wp-content/uploads/2016/08/eptac_08_17_16.pdf
| https://www.eptac.com/wp-content/uploads/2021/11/eptac_08_17_16.pdf
Heller Industries Inc. | https://hellerindustries.com/nonwetting/
worklife Ambient humidity and temperature beyond paste work envelope A palladium lead finish which requires higher reflow (liquidus) temperature Reflow-related causes of PCB Nonwetting: Peak reflow (liquidus
DriSteem provides reliable and efficient humidity control, evaporative cooling, and water treatment solutions for commercial and industrial applications.
14949 Technology Drive
Eden Prairie, MN USA
Phone: 952-949-2415