Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296
. This paper presents some of the initial thermal cycling results from a major industrial consortia project established to evaluate the thermal fatigue reliability of multiple SAC-based solder alloys
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
., Osaka, Japan 6Heraeus, Frankfurt, Germany 7Indium Corp., Clinton, NY, USA richard.coyle@nokia-bell-labs.com david.hillman@rockwellcollins.com ABSTRACT A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
) was measured for three different printed circuit board (PCB) thicknesses, 1.2 mm, 1.6 mm, and 2.4 mm. The reliability testing was performed using accelerated thermal cycling (ATC
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5052
) as a result of the coarsening of intermetallic phases over time. Recent studies have shown that the addition of bismuth (Bi) to the alloy results in superior performance over SAC and Sn-Pb in accelerated thermal cycling (ATC
GPD Global | https://www.gpd-global.com/co_website/conformal-coating-spray-masking.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/conformal-coating-spray-masking.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/conformal-coating-dispensing.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
., Osaka, Japan 6Heraeus, Frankfurt, Germany 7Indium Corp., Clinton, NY, USA richard.coyle@nokia-bell-labs.com david.hillman@rockwellcollins.com ABSTRACT A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
., Osaka, Japan 6Heraeus, Frankfurt, Germany 7Indium Corp., Clinton, NY, USA richard.coyle@nokia-bell-labs.com david.hillman@rockwellcollins.com ABSTRACT A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance
GPD Global | https://www.gpd-global.com/co_website/video-coating-process-applications.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
