| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must/
Gold Embrittlement: When Gold Removal is a Must - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must
Gold Embrittlement: When Gold Removal is a Must - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
entire solder joint. The emphasize of these changes are due to problems in the field with gold embrittlement, simply stating that all plated through hole components that are to be hand soldered must be tinned regardless
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
? Have you experienced RF component manufacturers that only offer SMT components with gold finish before? Does the concern of gold embrittlement take into account how much solder paste is being deposited in a surface mount solder joint? Answer
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
) when the solder gold content exceeds 5% by weight. Controlling the component gold plating thickness as well as the soldering process temperature and time can prevent gold embrittlement
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
entire solder joint. The emphasize of these changes are due to problems in the field with gold embrittlement, simply stating that all plated through hole components that are to be hand soldered must be tinned regardless
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