Partner Websites: hydrogen embrittlement gold solder (Page 1 of 2)

Gold Embrittlement: When Gold Removal is a Must - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must/

Gold Embrittlement: When Gold Removal is a Must - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

Gold Embrittlement: When Gold Removal is a Must - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must

Gold Embrittlement: When Gold Removal is a Must - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal

| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal

entire solder joint.   The emphasize of these changes are due to problems in the field with gold embrittlement, simply stating that all plated through hole components that are to be hand soldered must be tinned regardless

J-STD-001E-2010: 4.5.1, Gold Removal Issues - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues

? Have you experienced RF component manufacturers that only offer SMT components with gold finish before? Does the concern of gold embrittlement take into account how much solder paste is being deposited in a surface mount solder joint? Answer

Dissolution Rate of Specific Elements in SAC305 Solder

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255

) when the solder gold content exceeds 5% by weight. Controlling the component gold plating thickness as well as the soldering process temperature and time can prevent gold embrittlement

Surface Mount Technology Association (SMTA)

J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal - EPTAC - Train. Work

| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/

entire solder joint.   The emphasize of these changes are due to problems in the field with gold embrittlement, simply stating that all plated through hole components that are to be hand soldered must be tinned regardless

Webinars - EPTAC - Train. Work Smarter. Succeed (2)

| https://www.eptac.com/webinars/page/2

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