ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0434-pqfp-production-scanning
Production Scanning - Application Note 434 Sample & Method A tray of 24 PQFPs was imaged at high resolution on the automated FACTS2 system, shown above
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0543-csp-voids
packages, voids are shown in red. Sample & Method The die in this CSP is positioned face down. The package was imaged through the back of the die and focused at the front side
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0800-seal-voids
Transmission - Application Note 800 Sample & Method This blister pack was imaged using the THRU-Scan. Result The blue areas are locations of signal loss, representing voids which block transmission of the ultrasound through the sample
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0148-pqfp-die-attach
& Method A PQFP was imaged from the top side at a frequency of 15 MHz. Gating was on the die attach. Result The yellow central area is die attach material
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2641-3d-delaminations
- Application Note 2641 Sample & Method A plastic BGA substrate, imaged as an acoustic solid by the 3V module. Result The acoustic solid has been tilted and rotated
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0305-smart-card-delaminations
Induction Coil Defects - Application Note 305 Acoustic image left, showing delaminations (black areas). Sample & Method A non-contact style Smart Card was imaged on C-SAM to look for potential defects along the section of the induction coil running near the bond pads
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0801-seal-voids
Transmission - Application Note 801 Sample & Method A polymer pouch was imaged using the THRU-Scan. Result The blue areas within the seal (gray band
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2250-lead-and-paddle-delaminations
Lead and Paddle Delaminations - Application Note 2250 Sample & Method An SOJ imaged on C-SAM, with gating at the die, lead frame and paddle depths
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2466-multiple-voids
- Application Note 2466 Sample & Method A flip chip assembly, imaged by the 3V module through the overlying silicon die. Result The four small white features are voids in the cured underfill
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2614-c-sam-and-q-bam
cross-section - Application Note 2614 Sample & Method This BGA was first imaged in planar mode by C-SAM (bottom half of image). Along the white line drawn across the planar image, a cross-sectional Q-BAM image was then made (top half of image
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