15 imc results

Partner Websites: imc (Page 1 of 2)

Problems With PCB Micro Voiding - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/problems-with-pcb-micro-voiding/

. Can you give me some background on this issue, as we are trying to determine the root cause of this problem? Answer: IMC Microvoids, as defined in IPC-7095C Design and Assembly Process Implementation for BGAs, on page103. In the section

. The most important phases are AuSn4 and AuSn2 intermetallic compound phases. •  The embrittlement is the result of a large volume fraction of hard Au-Sn IMC platelets in the ductile Sn-Pb matrix

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

. • The embrittlement is the result of a large volume fraction of hard Au-Sn IMC platelets in the ductile Sn-Pb matrix. 12 Gold Embrittlement 13 Gold Embrittlement The data presented in these figures are from a theoretical calculation and have not been tested in practice but should be useful as a guide to avoiding

| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf

Basic Requirements for Reflow Soldering Oven-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,13161&url=_print

. Controlled tin flow direction; 5. The soldering surface does not move during reflow soldering. 1. Appropriate heat. Appropriate heat means that for the reflow soldering materials, there must be enough thermal energy to melt them and form an intermetallic interface (IMC

Addressing the Issues Around Solder Joint Voids in Surface Mount Products 1 2 2 Types of voids •  Macrovoids •  Planar Microvoids •  Shrinkage Voids •  Micro-Via Voids •  IMC Microvoids •  Pinhole Microvoids Voids in Solder Joints, Raiyo F, Aspandiar, Intel Corp 3 The Genesis

| https://www.eptac.com/wp-content/uploads/2012/06/eptac_07_18_12.pdf

Basic Requirements for Reflow Soldering Oven-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2019-12-17/13161.chtml

. 1. Appropriate heat. Appropriate heat means that for the reflow soldering materials, there must be enough thermal energy to melt them and form an intermetallic interface (IMC

High Reliability Alloy Solder Paste For ENIG - PCBASupplies

| https://pcbasupplies.com/alloy-solder-paste-enig/

. Recommended for ENIG finish In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf

. The solubility of nickel in the indium is very low so diffusion-controlled growth of the intermetallic (IMC) layer is slow. On exposure to air, nickel forms a unsolderable oxide on its surface, so it is protected with a flash coating of gold. In

Heller Industries Inc.

Professional Development Courses | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm

:00pm This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints. The reliability discussed includes joint mechanical properties, development of type and extent of intermetallic compounds (IMC

Surface Mount Technology Association (SMTA)