| https://www.eptac.com/ask/problems-with-pcb-micro-voiding/
. The true root cause is still under investigation, but a Kirkendall voiding mechanism may play a part. These voids can affect solder joint reliability, particularly in instances when brittle fracture is initiated within the IMC during drop or mechanical hock to the solder joint
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm
:00pm This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints. The reliability discussed includes joint mechanical properties, development of type and extent of intermetallic compounds (IMC
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
(Note that in SnPb solder joint, Cu6Sn5 present at the interface between SnPb solder and the Cu pad) and Ag3Cu intermetallic compound (IMC
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
(Note that in SnPb solder joint, Cu6Sn5 present at the interface between SnPb solder and the Cu pad) and Ag3Cu intermetallic compound (IMC
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