Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
reference [7], an optimum gold thickness was determined. At the low end, the gaps in the plating resulted in voiding. At the high end, excess IMC growth occurred during reflow and reliability testing. The bondline thickness (BLT) of indium solder preforms is
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. The maximum temperature, on the other hand, depends on the board size, board thickness, component configuration, material thermal mass, oven capability, and etc
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
. The maximum temperature, on the other hand, depends on the board size, board thickness, component configuration, material thermal mass, oven capability, and etc
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Suthakaran, Russell Brush, Doug Perovic Abstract 31-1 Influence of Electroless Pd Plating Film Thickness on Solder Joint Relibility of ENEPIG Yoshinori Ejiri, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki
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