Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
? Chemical Engineer, Honeywell FM&T 2016 Thomas Reeve , Purdue University Paper: "Heterogeneous Nucleation of ß-Tin in Lead-Free, Tin-Based Solder Alloys" Where is he now
| https://www.eptac.com/3d-electronics-as-an-alternative-to-printed-circuit-boards-pcbs/
) Posted on 8th October, 2020 by Leo Lambert Recent Articles IoT and the Aerospace Industry – Too Risky? Leaded vs. Lead-Free Solder: Which is Better? The 5 Essential Tools for Soldering The Importance of IPC-A-610 Certification How to Build on Your Career in Soldering Categories Blog Uncategorized Why Get IPC Certified It began with wire-wraps and
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Abstract 32-2 The Study of Dissolution of Bi Precipitates in Sn Using a Novel In Situ Heating Technique in the SEM Peter Banh, André M. Delhaise, Doug D. Perovic Abstract 32-2 Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage, Part I
GPD Global | https://www.gpd-global.com/co_website/pdf/GPD-Global-CMRT-2021.xlsx
. Added “United Precious Metal Refining Inc.” as a gold refiner 14. Added “Yokohama Metal Co Ltd” as a gold refiner 15. Added “CNMC (Guangxi) PGMA Co., Ltd.” as a tin refiner 16
GPD Global | https://www.gpd-global.com/pdf/GPD-Global-CMRT-2021.xlsx
. Added “United Precious Metal Refining Inc.” as a gold refiner 14. Added “Yokohama Metal Co Ltd” as a gold refiner 15. Added “CNMC (Guangxi) PGMA Co., Ltd.” as a tin refiner 16
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. A total of six Pb-free alloys and a eutectic tin/lead (Sn-Pb) control alloy were included in the evaluation. Specifically, two binary eutectic and four ternary “near eutectic” Pb-free alloys were included. Each of the “alternative Pb-free alloys
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
reference [7], an optimum gold thickness was determined. At the low end, the gaps in the plating resulted in voiding. At the high end, excess IMC growth occurred during reflow and reliability testing. The bondline thickness (BLT) of indium solder preforms is
