| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/
: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/soldertip/soldertips-dealing-with-the-problems-of-soldering-iron-tips-breaking-down/
. We are soldering lead free materials between 600 and 700 degrees F and increasing the contact dwell time by about 1 to 1.5 seconds. The new lead free alloys are high in tin content and the tin will dissolve the plating on the solder iron tip and eventually eat through the tip
. Read Answer Maximum Limits of Solder Bath Contamination Question: If we are using a solder pot to tin wires and create solder joints (splices
| https://www.eptac.com/faqs/soldertips?hsLang=en
: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/faqs/soldertips
: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Hersh Kohli, Motorola, Illinois "E-Manufacturing Software for Product and Process Real-Time Monitoring" 2000: Andrew Mawer, Motorola SPS, Texas "Automotive PBGA Assembly and Board-Level Reliability with Lead-Free Versus Lead-Tin Interconnect" 1999
| https://www.eptac.com/solder-tips/
: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces