Partner Websites: immersion and silver and corrosion (Page 8 of 9)

Solder Selection Guide | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide

Relations English Note that translations were done with a combination of human and machine processes, and accuracy may vary. Deutsch (Deutschland) English español (España, alfabetización internacional) français (France) italiano (Italia) português (Brasil) 한국어(대한민국) 中文(中国) 日本語 (日本) Products & Applications Back Products

ASYMTEK Products | Nordson Electronics Solutions

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

.   Alloy A substance composed of two or more metal elements. Example: Sn96.5 Ag3.0 Cu0.5 is 96.5% Tin, 3.0% Silver, and 0.5% Copper. Generally, alloys will have different properties than those exhibited by their individual elements (e.g

ASYMTEK Products | Nordson Electronics Solutions

Guide to a Successful Lead-Free Soldering - Blackfox

Blackfox Training Institute, LLC | https://www.blackfox.com/guide-to-a-successful-lead-free-soldering/

. Lead-free soldering produces a clean and excellent finish and has less risk of corrosion. For this reason, lead-free soldering is used in many of the latest consumer electronics that we use today

Blackfox Training Institute, LLC

Webinars

Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/

conditions. Webinar Content: What is solderability ? Component and printed board storage life Storage conditions for longer life Artificial ageing tests and impact on yields International specifications and test methods Cost of Gold, Copper, Palladium, Silver

Surface Mount Technology Association (SMTA)

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms

. Activator is consumed by heat over time.   Alloy A substance composed of two or more metal elements. Example: Sn96.5 Ag3.0 Cu0.5 is 96.5% Tin, 3.0% Silver, and 0.5% Copper. Generally, alloys will have different properties than those exhibited by their individual elements

ASYMTEK Products | Nordson Electronics Solutions

Semiconductor

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor

. With Nordson semiconductor manufacturing equipment, including bondtesters, dual dispensers and UV curing ovens, you can create packaging to protect against impact and corrosion

ASYMTEK Products | Nordson Electronics Solutions

Download Webinars/Webtorials On-Demand

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm

BGA Assembly: Low-Silver Lead Free BGA Spheres into Tin-Lead & LF Assembly Processes   Chrys Shea, Quyen Chu, and Ken Hubbard  Free! 2009  Cleaning, Coating and Functional Climatic Reliability   Ravi Parthasarathy, M.S.Chem.Eng.  Free! 2008  Design for

Surface Mount Technology Association (SMTA)

Calendar of Events

Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm

solderability ? Component and printed board storage life Storage conditions for longer life Artificial ageing tests and impact on yields International specifications and test methods Cost of Gold, Copper, Palladium, Silver, tin etc Protective coatings and effects

Surface Mount Technology Association (SMTA)

Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf

-free Solder Alloys with OSP and Immersion Silver PCB Finish,” Proceedings of SMTA International 2005, Chicago, IL, USA, Sept. 25-29, 2005, pp. 568-575. Siewert, T.; Liu, S.; Smith, D. R.; and Madeni, J. C., (2002), “Database for Solder Properties with

Heller Industries Inc.

Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf

-free Solder Alloys with OSP and Immersion Silver PCB Finish,” Proceedings of SMTA International 2005, Chicago, IL, USA, Sept. 25-29, 2005, pp. 568-575. Siewert, T.; Liu, S.; Smith, D. R.; and Madeni, J. C., (2002), “Database for Solder Properties with

Heller Industries Inc.


immersion and silver and corrosion searches for Companies, Equipment, Machines, Suppliers & Information