| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
problem with the adhesion of the final coating. You don’t mention what type of flux is being used, but this is one place where an aggressive flux can be used to remove the passivation from the nickel coating
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
problem with the adhesion of the final coating. You don’t mention what type of flux is being used, but this is one place where an aggressive flux can be used to remove the passivation from the nickel coating
. Can you explain what the “standard industry practice” is? Read Answer J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed Question
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-and-fabrication-in-the-aerospace-industry/
with immersion gold coating (ENIG) and immersion silver. Hot air solder leveling (HASL) is a type of PCB finish that involves dipping the PCB into molten solder, which covers exposed copper surfaces. The PCB is then passed between hot air knives to
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