Partner Websites: immersion silver pad adhesion (Page 1 of 2)

3M Product Summary

ORION Industries | http://orionindustries.com/pdfs/3MPR0DUCTSUMMARY.pdf

3.1 High tack excellent adhesion to LSE plastics. Automotive label bonding High 9459S 1.5 55# DK 3.1 Silver adhesive for duable fie extingusher label opacity Strength 9459W 1.5 55# DK

ORION Industries

First Bond Ball Pull Stud Bump Pull | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=8

. First bond ball pull utilises cold bump pull jaw technology to apply a vertical load (a pull test) to ball bonds and stud bumps. Ball shear tests can sometimes promote pad cratering due to the aggressive nature of the bonding process which can weaken the ball bonds

ASYMTEK Products | Nordson Electronics Solutions

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

, David Braun Abstract 22-2 EFFECTS OF STORAGE PROCEDURES AND BAKE OUT ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, et al. Abstract 22-1 A CASE STUDY FOR TRANSITIONING CLASS A SERVER MOTHERBOARDS TO LEAD-FREE R

Surface Mount Technology Association (SMTA)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

] Investigation Specifics:  84 I/O Plastic CSP, daisy chained, 0.3mm (12 mil) diameter solderballs  Sn63 solder paste  Test vehicle: Characteristics not available, Immersion Silver (IAg) and ENIG finishes  Thermal cycling: 0°C-100

Heller Industries Inc.

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

] Investigation Specifics:  84 I/O Plastic CSP, daisy chained, 0.3mm (12 mil) diameter solderballs  Sn63 solder paste  Test vehicle: Characteristics not available, Immersion Silver (IAg) and ENIG finishes  Thermal cycling: 0°C-100

Heller Industries Inc.

Kapton Polymide Film

ORION Industries | http://orionindustries.com/pdfs/kapton.pdf

4.0 ASTM D-570-92, using Absorption, %, 24-hr immersion at 23°C (73°F). max. Average of three specimens. **Also applies to Type VN, except shrinkage, which is shown in Table 5

ORION Industries

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

] that the immersion silver surface finish selected for lead-free PCBs had the susceptibility to creep corrode when used in high sulfur and high humidity environments

Surface Mount Technology Association (SMTA)

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

.   Alloy A substance composed of two or more metal elements. Example: Sn96.5 Ag3.0 Cu0.5 is 96.5% Tin, 3.0% Silver, and 0.5% Copper. Generally, alloys will have different properties than those exhibited by their individual elements (e.g

ASYMTEK Products | Nordson Electronics Solutions

Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf

-free Solder Alloys with OSP and Immersion Silver PCB Finish,” Proceedings of SMTA International 2005, Chicago, IL, USA, Sept. 25-29, 2005, pp. 568-575. Siewert, T.; Liu, S.; Smith, D. R.; and Madeni, J. C., (2002), “Database for Solder Properties with

Heller Industries Inc.

Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf

-free Solder Alloys with OSP and Immersion Silver PCB Finish,” Proceedings of SMTA International 2005, Chicago, IL, USA, Sept. 25-29, 2005, pp. 568-575. Siewert, T.; Liu, S.; Smith, D. R.; and Madeni, J. C., (2002), “Database for Solder Properties with

Heller Industries Inc.

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