| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly
board’s acceptance in final assembly? Answer: The gold plating on boards is typically an ENIG coating, which is Electroless Nickell, Immersion Gold plating
| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/
board’s acceptance in final assembly? Answer: The gold plating on boards is typically an ENIG coating, which is Electroless Nickell, Immersion Gold plating
| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads
: This is a very interesting question regarding the reflow of immersion tin plating. I’ve found and attached this web site that discusses this particular issue. http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=4684411&url=http%3A%2F%2Fieeexplore.ieee.org%2Fstamp%2Fstamp.jsp%3Ftp%3D%26arnumber
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. Although gold is a noble metal, the methodology for its application, be it electroplating or immersion plating, gold will still go into a molten tin/lead or tin solder solution
| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/
: This is a very interesting question regarding the reflow of immersion tin plating. I’ve found and attached this web site that discusses this particular issue. http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=4684411&url=http%3A%2F%2Fieeexplore.ieee.org%2Fstamp%2Fstamp.jsp%3Ftp%3D%26arnumber
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5495
: The influence of the electroless deposition of Pd in electroless Ni-P/electroless Pd/immersion Au (ENEPIG) plating was investigated on the reliability of Au and Cu wire-bonding
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. Although gold is a noble metal, the methodology for its application, be it electroplating or immersion plating, gold will still go into a molten tin/lead or tin solder solution
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post9030.html
) Plating for Printed Ciruit Boards IPC-4553 - Specification for Immersion Silver Plating for Printed Ciruit Boards IPC-4554 - Specification for Immersion Silver Tin for Printed Ciruit Boards IPC-4562
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html
) Plating for Printed Ciruit Boards IPC-4553 - Specification for Immersion Silver Plating for Printed Ciruit Boards IPC-4554 - Specification for Immersion Silver Tin for Printed Ciruit Boards IPC-4562
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html
) Plating for Printed Ciruit Boards IPC-4553 - Specification for Immersion Silver Plating for Printed Ciruit Boards IPC-4554 - Specification for Immersion Silver Tin for Printed Ciruit Boards IPC-4562
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