| https://www.eptac.com/blog/increase-quality-efficiency-profits-with-solder-training-ipc-certification
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| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/increase-quality-efficiency-profits-with-solder-training-ipc-certification/
Increase Quality, Efficiency & Profits with Solder Training & IPC Certification - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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. Oxidation can adversely affect die attachment when eutectic solder is used as an adhesive material for die bonding. Wire Bond - Gas plasma technology can be used to plasma clean pads prior to wire bonding to improve bond strengths and yields
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