Partner Websites: indium 3.2 solder ball (Page 1 of 2)

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf

/125 °C profiles. The key findings from the thermal cycling tests and subsequent failure analysis are as follows: ▪ X-ray and metallographic inspections showed that the solder paste was effective at producing extreme voiding in many of the ball locations

Heller Industries Inc.

Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296

containing various combinations of solid solution and dispersion strengthening agents. Daisy chained ball grid array (BGA) test vehicles were fabricated with SAC305 as a baseline and three different developmental alloys each employing significant additions of various combinations of antimony (Sb), indium (In), and bismuth (Bi

Surface Mount Technology Association (SMTA)

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

/125 °C profiles. The key findings from the thermal cycling tests and subsequent failure analysis are as follows: ▪ X-ray and metallographic inspections showed that the solder paste was effective at producing extreme voiding in many of the ball locations

Heller 公司

Best Papers - Award Winners | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm

., Nokia Bell Labs " Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability " 2019 3rd Place

Surface Mount Technology Association (SMTA)

Electronics in Harsh Environments Conference

Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm

(Advanced Driver Assist Systems), reliability drivers have intensified. Karthik Vijay of Indium Corporation will present on a novel solder alloy that exceeds performance requirements as compared to SAC305 alloys

Surface Mount Technology Association (SMTA)

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