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(%) 0.0 Silver chromate paper test No discoloration Solder spread factor (%) 90 Solder wetting speed*1 (sec.) < 0.5 Aqueous solution resistivity* 2 (Ω • cm) > 1
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Leaded vs. Lead-Free Solder: Which is Better? - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/
. The solder joint has to be metallurgically bonded to the basis material, be it either tin, copper, silver, nickel, brass, etc. and we need to create the intermetallic compound, which allows the wetting between tin of the solder alloy and the basis material
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% Flux type ROL0 Alloy composition (%) Sn 40Pb Halide content(%) 0.0 Silver chromate paper test No discoloration Solder spread factor
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% Flux type ROL0 Alloy composition (%) Sn 40Pb Halide content(%) 0.0 Silver chromate paper test No discoloration Solder spread factor
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% Flux type ROL0 Alloy composition (%) Sn 40Pb Halide content(%) 0.0 Silver chromate paper test No discoloration Solder spread factor
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% Flux type ROL0 Alloy composition (%) Sn 40Pb Halide content(%) 0.0 Silver chromate paper test No discoloration Solder spread factor
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% Flux type ROL0 Alloy composition (%) Sn 40Pb Halide content(%) 0.0 Silver chromate paper test No discoloration Solder spread factor