ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/torsion-testing?con=t&page=15
-Destructive Techniques for Identifying Defect in BGA Joints: TDR, 2DX and Cross-section/SEM Comparison Nordson DAGE Explorer one Brochure v5c web Nordson DAGE Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE
Baja Bid | https://bajabid.com/wp-content/uploads/2023/06/XT-V-130-flyer-EN.pdf
. With the XT V 130, you can get the inside view of printed circuit boards, in a smooth, non-destructive process. The Nikon Metrology XT V130 X-ray inspection system is a high-precision, flexible solution that facilitates defect analysis in loaded PCB boards. Designed for 100% BGA and
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/creep-testing?con=t&page=15
Image Capture System Datasheet Nordson DAGE Non-Destructive Techniques for Identifying Defect in BGA Joints: TDR, 2DX and Cross-section/SEM Comparison Nordson DAGE Explorer one Brochure v5c web Nordson DAGE Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/flexural-testing?con=t&page=15
System Datasheet Nordson DAGE 4600LF Data Sheet Nordson DAGE Non-Destructive Techniques for Identifying Defect in BGA Joints: TDR, 2DX and Cross-section/SEM Comparison Nordson DAGE Explorer one Brochure v5c web Nordson DAGE Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/compression-testing?con=t&page=15
MATRIX and Nordson YESTECH Inspection Systems at SMT Image Capture System Datasheet Nordson DAGE 4600LF Data Sheet Nordson DAGE Non-Destructive Techniques for Identifying Defect in BGA Joints
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/peel-testing?con=t&page=15
Identifying Defect in BGA Joints: TDR, 2DX and Cross-section/SEM Comparison Nordson DAGE Explorer one Brochure v5c web Nordson DAGE Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE First
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_glenbrook_rtx113_xray.html
Glenbrook Xray Glenbrook Xray Equipment Description Glenbrook Model Number: RTX-113 Serial Number: B1402-1630M Joystick Control BGA and Other Device Inspection X / Y Movement Complete with PC, Monitor, Keyboard, Mouse Portable on Wheels Location: Boston, MA Price
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/ja-JP/divisions/dage/about/news/dr-evstatin-krastev-from-nordson-dage-to-present-two-ground-breaking-x-ray-inspection-studies
響と比較することを目指した定量分析は行われていません。 この研究では、大基板対応 CT の技術を定評ある接合強度試験シェアの手法と併用して、シェア テストで測定された接合強度を、大基板対応 CT で判定されたボイディングのサイズおよび位置と相関させることを目指しました。確かな統計的有意性を確認するため、膨大な数の PCB に取り付けられた BGA デバイスを利用しました。 またプロセスを加速させるため、ボンドテスターと X 線の両方による測定にさまざまなレベルの自動化が採用されました。 Flextronics と Nordson DAGE は、共同で“Optimizing X-ray Inspection with Package on Package
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/packaging?con=t&page=4
/ 3D X-ray Inspection - Emphasis on BGA, QFN, 3D Packages and Counterfeit Components Nordson DAGE 3-4 Point Bend Flexural Testing Application Note Nordson DAGE Cu Pillar Application Note Nordson DAGE
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/application/smt
fällen und verstehen, wo im Produktionsprozess der Defekt aufgetreten sein könnte. Modern 2D / 3D X-ray Inspection - Emphasis on BGA, QFN, 3D Packages and Counterfeit Components - Überblick über die
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Equipment Dealer / Broker / Auctions
Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea
Phone: +82-1029254936
