Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
desirable but sufficient solder voids greater than the IPC-JSTD-001 specification of 25% were observed to make the investigation valid. Figure 11 (top) illustrates voids of 32% and 29% area on the inner rows of a test component. Additionally, the low voiding
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
desirable but sufficient solder voids greater than the IPC-JSTD-001 specification of 25% were observed to make the investigation valid. Figure 11 (top) illustrates voids of 32% and 29% area on the inner rows of a test component. Additionally, the low voiding
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/jet-dispensers?nor_division_facet_a=7a72ff77488349c997328af4701a7d22&con=t&page=32
Lubrication Systems Mixers Pest Control Systems Reservoirs and Pumps Solder Paste and Flux Syringe Barrels and Cartridges Thermal Compounds (TIM) Two-Component (2k
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/jet-dispensers?nor_division_facet_a=8180c7e6674843b6b85078b41fcf7a9a&con=t&page=32
Lubrication Systems Mixers Pest Control Systems Reservoirs and Pumps Solder Paste and Flux Syringe Barrels and Cartridges Thermal Compounds (TIM) Two-Component (2k
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
testing. At present, what we use the most is high-temp solder. High-temp solder SMT-adhesive or high-temp adhesive tape is used to fix the test head of memory device’s thermocouple to PCB’s test points and then high-temp adhesive or glue is used to fix the
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/busting-the-encoder-resolution-myth-understanding-what-defines-true-dispense-accuracy
. But to achieve that, you need to know more than what the machine’s encoder can do. Don’t settle for incomplete information or insufficient test results
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. This choice also affects your fabricator’s ability to make it, so you must ensure it’s a material they can handle. The materials most commonly used in PCB substrates include the following
| http://etasmt.com:9060/te_news_industry/2021-09-01/24163.chtml
near the thermocouple and cause higher test cost. Suitable for high-density multiple-point continuous testing. At present, what we use the most is high-temp solder. High-temp solder SMT-adhesive or high-temp adhesive tape is used to fix the test head of
| http://etasmt.com/te_news_industry/2021-09-01/24163.chtml
near the thermocouple and cause higher test cost. Suitable for high-density multiple-point continuous testing. At present, what we use the most is high-temp solder. High-temp solder SMT-adhesive or high-temp adhesive tape is used to fix the test head of
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. The 4000 Plus Bondtester measures the pull and shear adhesion strengths of components, and the 4000HS specifically designed to measure drop test strengths of components, especially useful for qualifying brittle lead-free solder alloys
