Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. However, this type of removal is not effective when the root cause stems from misprinted PCBs and pre-reflow solder paste issues. As a result, it is best to diagnose the cause of solder balls as early as possible, as these processes can negatively influence your PCB manufacturing and production
| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them
. Solder-Starved Joint A solder-starved joint is just that: a joint that does not have enough solder. Despite making the necessary electrical contact, the insufficient solder weakens the joint and increases susceptibility to cracking and failure
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5
| https://www.eptac.com/soldertip/solder-pot-maintenance-and-dross-removal/
. Does turning up the solder pot too high cause impurities to collect on parts? Can you comment on this? More SolderTips SolderTip #36: Wave Soldering Insufficient Fill and Voids in PTH SolderTip
| https://www.eptac.com/soldertip/accept-or-reject-solder-contacting-component-bodies/
. When solder touches the body of a component, be it either PTH or SMT components, there is a possibility that it can destroy the seal where the lead enters the component body and cause issues in the
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
z dimensions, and get further to root cause X. CONCLUSIONS The increasing usage of heterogeneous integration will lead to increasing complexities in manufacturing assemblies and stresses during system lifetime (Fig. 24): from more benign but long
| https://www.eptac.com/5-common-solder-mistakes-and-how-to-resolve-them/
. Solder-Starved Joint A solder-starved joint is just that: a joint that does not have enough solder. Despite making the necessary electrical contact, the insufficient solder weakens the joint and increases susceptibility to cracking and failure
| https://www.eptac.com/soldertip/whats-with-the-expiration-dates-on-solder-paste-or-wire/
What’s with the expiration dates on solder paste or wire? - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5
