| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=_print
: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them
: What causes insufficient wetting in soldering? A: Insufficient wetting refers to solder that doesn’t spread evenly across the surface of the joint or
Baja Bid | https://bajabid.com/wp-content/uploads/2021/09/Viscom-S3016-OEM.pdf
very different inspection object types Optional return transport of the manufactured products Insufficient wetting (front) and missing pin (back) Reliable 3D inspection of THT solder joints Dimensions in mm Front view Top viewSide view with optional return transport
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23570.chtml
:3 Process and design-related causes: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
| http://etasmt.com/te_news_bulletin/2021-08-31/23570.chtml
:3 Process and design-related causes: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
| http://etasmt.com/cc?ID=te_news_bulletin,13161&url=_print
. Reflow soldering oven characteristics Basic requirements for reflow soldering ovne: Proper heat 2. Good wetting; 3. Proper solder joint size and shape; 4
Heller Industries Inc. | https://hellerindustries.com/heller/formic-acid-reflow-process/
. Low O2 ppm levels are essential for a quality formic process. Ensure that O2 levels are <20ppm for all oven zones. The main indicator of a good formic reflow process is whether proper wetting of the solder is occurring
Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/
Excessive Heating Rate Preheat Temp Low Solder Paste Oxidation Screen/Stencil Clogged Insufficient Solder Paste Oxidized Solder Paste Paste Viscosity Too Low Misaligned Component Excess Solder Deposition
| http://etasmt.com/te_news_bulletin/2019-12-17/13161.chtml
. The reflow manufacturer ETA will analyze it in detail. Reflow soldering oven characteristics Basic requirements for reflow soldering ovne: Proper heat 2. Good wetting; 3
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Activator cleans metal surfaces of oxides and contaminants, promoting wetting of Solder Alloy. Activator is consumed by heat over time
