| http://etasmt.com/te_news_bulletin/2021-08-31/23570.chtml
:3 Process and design-related causes: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/heated-stage
. Pre-reflow factors that can cause HIP include insufficient paste, bad placement, contamination/ oxidization (during handling or storage
Baja Bid | https://bajabid.com/wp-content/uploads/2021/09/Viscom-S3016-OEM.pdf
very different inspection object types Optional return transport of the manufactured products Insufficient wetting (front) and missing pin (back) Reliable 3D inspection of THT solder joints Dimensions in mm Front view Top viewSide view with optional return transport
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
—User-Friendly Software with Multiple Control Points Results: DBC at Heat Sink Exhibit 7—No Vacuum vs. Vacuum on Heat Sink (<1% voids) Results: Automotive QFN Exhibit 8
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
—User-Friendly Software with Multiple Control Points Results: DBC at Heat Sink Exhibit 7—No Vacuum vs. Vacuum on Heat Sink (<1% voids) Results: Automotive QFN Exhibit 8
Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/
. The related manufacturing personnel are well aware of common encumbering defects happen erratically with this process. Some of these defects encountered daily are bridging, solder skips, solder voids and insufficient barrel fill or hole-fill
Heller Industries Inc. | https://hellerindustries.com/recent-searches/
1706 exl 1800exl 1707 mark 5 heller Uf3800 underfill Hac1 manual Vapor phase reflow Rma 204 Reflow soldering on surface mount Reflow qfn Reflow temperature for lead solder Hex250l Training Reflow
| https://www.smtfactory.com/Introduction-to-the-working-principle-of-Lyra-Reflow-Oven-id45852477.html
. If the peak temperature of Lyra Reflow Oven is too low, it is easy to produce cold junctions and insufficient wetting; if Lyra Reflow Oven is too high, the epoxy resin substrate and the plastic part will be coking and delamination prone to occur, and excessive eutectic metal compounds will form and cause brittleness
| https://www.smtfactory.com/Working-principle-of-I-C-T-Lyra-Series-Reflow-Oven-id48502887.html
. If the peak temperature of Lyra Reflow Oven is too low, it is easy to produce cold junctions and insufficient wetting; if Lyra Reflow Oven is too high, the epoxy resin substrate and the plastic part will be coking and delamination prone to occur, and excessive eutectic metal compounds will form and cause brittleness
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
?, so the lowest peak temperature is about 210? or so). Too low peak temperature may lead to cold junction and insufficient wetting easily, and thus cold soldering due to insufficient melting