ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/3d-packaging-and-wafer-level-packaging
& Wafer-Level Packaging Dispensing applications for stacked dies with through silicon vias (TSV) and face-to-face stacked dies 3D packages are emerging in the semiconductor packaging industry to address the serious technical challenges such as miniaturization, faster interconnections, power
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/alternative-energy
. Photovoltaics - Via Filling for Interconnection Via filling for interconnections between the front and back of photovoltaic (PV) cells can be achieved by using non-contact jet dispensing , which helps make the roll-to-roll process more efficient. Many CIGS
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0540-csp-delaminations
. The interconnections between the die and substrate are done with TAB (Tape Automated Bond) like connections. This part is flipped over and viewed through the solder ball/flex substrate side
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/events/nepcon-south-china-2017
. Nordson DAGE also will highlight its award-winning 4000Plus Bondtester with Camera Assist Automation, ideally suited for pull-and-shear testing of wafer interconnections, lead frames, hybrid
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/about-us/news/nordson-dima-at-smt-hybrid-2018
C-slide , is ideal for all kinds of applications using Anisotropic Conductive Film (ACF) final or heat-seal bonding, hot bar reflow soldering, and heat staking processes to produce LCD, flex foil, and PCB interconnections
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nepcon-south-china-2017
5 the leading choice for printed circuit board and semiconductor package inspection. Nordson DAGE also will highlight its award-winning 4000Plus Bondtester with Camera Assist Automation, ideally suited for pull-and-shear testing of wafer interconnections, lead frames, hybrid
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dage-awarded-a-global-technology-award-for-camera-assist-automatic-bondtesting
. Built around a unique multi-function cartridge, the camera assist automation system is ideally suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dage-to-launch-new-4800-wafer-level-bondtester-at-semicon-west
. The virtual images for each test pattern enable easy editing. Nordson DAGE also will highlight its award-winning 4000Plus Bondtester Camera Assist Automation System, ideally suited for pull-and-shear testing of wafer interconnections, lead frames, hybrid
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dage-accepts-a-2014-npi-award-camera-assist-automatic-bondtesting-at-apex
. Built around a unique multi-function cartridge, the camera assist automation system is ideally suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid
