| http://etasmt.com/cc?ID=te_news_industry,24162&url=_print
-3.5um intermetallic compounds in soldering, intermetallic compound formation temperature is above the melting point of 10-15, the lead soldering is 195-200
| https://www.eptac.com/webinar/how-to-create-the-perfect-solder-joint/
creating that perfect solder joint every time. It is the intermetallic compound. This bond formed every time between solder and a base material is the key
| http://etasmt.com/te_news_industry/2021-09-01/24162.chtml
-3.5um intermetallic compounds in soldering, intermetallic compound formation temperature is above the melting point of 10-15, the lead soldering is 195-200
| http://etasmt.com:9060/te_news_industry/2021-09-01/24162.chtml
-3.5um intermetallic compounds in soldering, intermetallic compound formation temperature is above the melting point of 10-15, the lead soldering is 195-200
| https://www.eptac.com/webinars/how-to-create-the-perfect-solder-joint/
creating that perfect solder joint every time. It is the intermetallic compound. This bond formed every time between solder and a base material is the key
| https://www.eptac.com/webinars/how-to-create-the-perfect-solder-joint
creating that perfect solder joint every time. It is the intermetallic compound. This bond formed every time between solder and a base material is the key
| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
7.5.3.5 on IMC Microvoids it states: “… IMC Microvoids occur within the Intermetallic Compound (IMC) formed between copper and high tin solders, including SAC and tin/lead solders
| https://www.eptac.com/ask/problems-with-pcb-micro-voiding/
7.5.3.5 on IMC Microvoids it states: “… IMC Microvoids occur within the Intermetallic Compound (IMC) formed between copper and high tin solders, including SAC and tin/lead solders
