28 intermetallic compound results

, “Intermetallic Compound Growth and Solderability” Solderability •  The formation of the intermetallic plays a key role in most of the solder joint failure

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.   In our case a copper-tin intermetallic compound 6 Bonding Process Metal 1 Metal 2 Interface with Metals 1 & 2 e.g. Component e.g. Printed board 7 Wetting Angles 8 Equilibrium of Wetting 9 Poor Wetting And Its Causes

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SMT reflow oven process principle and introduction-SMT Technical-Reflow oven,SMT Reflow Soldering Ov

| http://etasmt.com/te_news_industry/2021-09-01/24162.chtml

-3.5um intermetallic compounds in soldering, intermetallic compound formation temperature is above the melting point of 10-15, the lead soldering is 195-200

SMT reflow oven process principle and introduction-SMT Technical-Reflow oven,SMT Reflow Soldering Ov

| http://etasmt.com:9060/te_news_industry/2021-09-01/24162.chtml

-3.5um intermetallic compounds in soldering, intermetallic compound formation temperature is above the melting point of 10-15, the lead soldering is 195-200

How to Create the Perfect Solder Joint - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/webinars/how-to-create-the-perfect-solder-joint/

creating that perfect solder joint every time. It is the intermetallic compound. This bond formed every time between solder and a base material is the key

How to Create the Perfect Solder Joint - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/webinars/how-to-create-the-perfect-solder-joint

creating that perfect solder joint every time. It is the intermetallic compound. This bond formed every time between solder and a base material is the key

Problems With PCB Micro Voiding - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding

7.5.3.5 on IMC Microvoids it states: “… IMC Microvoids occur within the Intermetallic Compound (IMC) formed between copper and high tin solders, including SAC and tin/lead solders

Problems With PCB Micro Voiding - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/problems-with-pcb-micro-voiding/

7.5.3.5 on IMC Microvoids it states: “… IMC Microvoids occur within the Intermetallic Compound (IMC) formed between copper and high tin solders, including SAC and tin/lead solders

. The most important phases are AuSn4 and AuSn2 intermetallic compound phases. •  The embrittlement is the result of a large volume fraction of hard Au-Sn IMC platelets in the ductile Sn-Pb matrix

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

.  We try to guess what the inside of the solder joint is all about by looking at outside characteristics.  But can all of this information tell us if there is a good intermetallic compound layer? 10 Prerequisites

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