23 intermetallic thickness results

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SMT reflow oven process principle and introduction-SMT Technical-Reflow oven,SMT Reflow Soldering Ov

| http://etasmt.com/cc?ID=te_news_industry,24162&url=_print

-3.5um thickness intermetallic compounds, intermetallic compound formation temperature is also above the melting point of 10-15 degrees, for lead-freesoldering, that is, 230-235 degrees

•  In Sn-rich solders on a Cu substrate, Cu6Sn5 (η) or Cu3Sn (ε) intermetallic layers are formed at the solder/substrate interface 6 Adapted by Influence of Initial Morphology and Thickness of Cu6Sn5 and Cu3Sn Intermetallics on Growth and Evolution during Thermal

| https://www.eptac.com/wp-content/uploads/2012/10/eptac_11_14_12.pdf

J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal

| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal

. It was found that the gold would go into solution and create a thick gold intermetallic condition creating fracture condition in solder joints

SMT reflow oven process principle and introduction-SMT Technical-Reflow oven,SMT Reflow Soldering Ov

| http://etasmt.com/te_news_industry/2021-09-01/24162.chtml

-3.5um thickness intermetallic compounds, intermetallic compound formation temperature is also above the melting point of 10-15 degrees, for lead-freesoldering, that is, 230-235 degrees

SMT reflow oven process principle and introduction-SMT Technical-Reflow oven,SMT Reflow Soldering Ov

| http://etasmt.com:9060/te_news_industry/2021-09-01/24162.chtml

-3.5um thickness intermetallic compounds, intermetallic compound formation temperature is also above the melting point of 10-15 degrees, for lead-freesoldering, that is, 230-235 degrees

J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal - EPTAC - Train. Work

| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/

. It was found that the gold would go into solution and create a thick gold intermetallic condition creating fracture condition in solder joints

2.54 µm [100 µin] or more of gold thickness –  From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

[N1D2D3] be removed: a. From at least 95% of the surfaces to be soldered of the through-hole component leads with 2.54 µm [100 µin] or more of gold thickness b. From 95

| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf

Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf

. The intermetallic layer thickness is another factor that would impact solder joint strength. The intermetallic layer is a critical part of a solder joint because it facilitates bonding between the solder and the substrate

Heller Industries Inc.