46969 | https://hellerindustries.com/intermetallics-growth
Heller Industries Inc.
| https://www.eptac.com/wp-content/uploads/2012/10/eptac_11_14_12.pdf
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. As stated in a article by Eric Bastow of Indium Corporation: Intermetallics in Soldering “Keep in mind that dissolution, the phenomenon of a solid dissolving into a liquid, is affected by both time and temperature
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. As stated in a article by Eric Bastow of Indium Corporation: Intermetallics in Soldering “Keep in mind that dissolution, the phenomenon of a solid dissolving into a liquid, is affected by both time and temperature
Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/
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| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml
. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels
