| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html
. Prevents ionic contamination Polar or ionic particles left over from flux residues and other sources, when exposed to moisture in ambient air and an electrical current are applied, can connect into
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/closed-loop-in-process-flux-verification
-loop system verification ensures flux is mitigated by solder nozzle without residue or ionic contamination. - Fully compatible with MicroDrop drop-jet flux dispenser to verify accuracy of flux application
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling?page=4
packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options
. Closed Loop In Process Flux Verification In-process closed-loop system verification ensures flux is mitigated by solder nozzle without residue or ionic contamination
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/in-process-flux-verification
- Closed-loop system ensures true no-clean processing since flux is mitigated by solder nozzle without residue or ionic contamination
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling?con=t&page=17
packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling?con=t&page=42
packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling?con=t&page=16
packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/drop-jet-fluxing
application of flux to target locations without overspray. - Provides true no-clean processing since flux is mitigated by solder nozzle without flux residue or ionic contamination
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling?con=t&page=15
packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
