| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/
: Class 2 vs Class 3 Assemblies SolderTip #40: Component Mounting and Acceptability Question: We are working with components with leads of tin/lead over nickel
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
. I would suggest a strong OAH1 FLUX, for tinning the components, with an appropriate cleaning afterwards to remove any of the ionic residues from the surfaces of the leads and components
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/microdrop-flux-dispenser
mitigated by solder nozzle without flux residue or ionic contamination - Compact design allows for easy servicing providing a maintenance-free production environment with minimal machine downtime - Available on Novo ®
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/in-process-flux-verification
- Closed-loop system ensures true no-clean processing since flux is mitigated by solder nozzle without residue or ionic contamination
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/drop-jet-fluxing
application of flux to target locations without overspray. - Provides true no-clean processing since flux is mitigated by solder nozzle without flux residue or ionic contamination
GPD Global | https://www.gpd-global.com/co_website/pdf/pump/Phosphors-LED.pdf
). The quality of white light produced by this class of LED is almost exclusively dependent on the properties of the phosphor. So to make better illumination-quality LEDs, which hold the key to the penetration of this light source into new markets, it is essential to develop better phosphors
GPD Global | https://www.gpd-global.com/pdf/pump/Phosphors-LED.pdf
). The quality of white light produced by this class of LED is almost exclusively dependent on the properties of the phosphor. So to make better illumination-quality LEDs, which hold the key to the penetration of this light source into new markets, it is essential to develop better phosphors
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling?page=1
packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling
packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
