ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-white-paper-plasma-clean-to-reduce-wire-bond-failures-now-available
Nordson MARCH White Paper, Plasma Clean to Reduce Wire Bond Failures, Now Available Online MARCH Products Corporate | Global Directory | Languages Division Only All of Nordson SEMI Systems AP Batch Series TRAK Automated Series SPHERE Wafer Series PCB Systems VIA High Volume Series ModVIA Expandable Plasma System Plasma Applications
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/microdrop-flux-dispenser
specific locations without overspray - Ideal for micro flux deposition of flux to small solder sites with unparalleled accuracy and minimal flux consumption - Provides true no-clean processing since flux is
40731 | https://www.smta.org/harsh/Harsh-Environments-Conference-Program-2020.pdf
Surface Mount Technology Association (SMTA)
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/in-process-flux-verification
- Closed-loop system ensures true no-clean processing since flux is mitigated by solder nozzle without residue or ionic contamination
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/drop-jet-fluxing
application of flux to target locations without overspray. - Provides true no-clean processing since flux is mitigated by solder nozzle without flux residue or ionic contamination
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/courses.cfm
. The microstructure makes up both electrical and physical connections. Changes can limit the devices useful life. In addition to the microstructure, there are many factors contributing to electrochemical failures on electronic devices including pitch, electrical field, ionic contamination and environmental conditions
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/closed-loop-in-process-flux-verification
-loop system verification ensures flux is mitigated by solder nozzle without residue or ionic contamination. - Fully compatible with MicroDrop drop-jet flux dispenser to verify accuracy of flux application
| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html
cleaning is a full and important production step. But even with the so-called no-clean manufacturing, it may be that these components must be cleaned to avoid malfunctions
| https://www.eptac.com/faqs/ask-helena-leo/page/8
. The excess no-clean flux is located in an Ethernet port connector. The units pass all tests with no issues, however; we have recently had a couple of field returns where it was
| https://www.eptac.com/faqs/ask-helena-leo/ask/type-of-water-to-use-on-soldering-sponges
I’ve paraphrased some of the statements from the site. From; http://www.biotechserv.com/lab_equipment_blog/2013/06/12/distilled-or-deionized-water-whats-the-difference/ Regular tap water has many ionic impurities and minerals which will react with the soldering iron tips
