PCB Libraries, Inc. | https://www.pcblibraries.com/forum/cleanliness-test_topic1738_post7101.html
PCBA Cleanliness test process? For Ionic Residues on PCBA, there are three methods of testing in IPC-TM-650: Dynamic Extraction Methods, Static Extraction Methods and manual method
40731 | https://www.smta.org/harsh/Harsh-Environments-Conference-Program-2020.pdf
Surface Mount Technology Association (SMTA)
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/courses.cfm
. The microstructure makes up both electrical and physical connections. Changes can limit the devices useful life. In addition to the microstructure, there are many factors contributing to electrochemical failures on electronic devices including pitch, electrical field, ionic contamination and environmental conditions
| https://www.eptac.com/ask/type-of-water-to-use-on-soldering-sponges/
I’ve paraphrased some of the statements from the site. From; http://www.biotechserv.com/lab_equipment_blog/2013/06/12/distilled-or-deionized-water-whats-the-difference/ Regular tap water has many ionic impurities and minerals which will react with the soldering iron tips
| https://www.eptac.com/faqs/ask-helena-leo/ask/type-of-water-to-use-on-soldering-sponges
I’ve paraphrased some of the statements from the site. From; http://www.biotechserv.com/lab_equipment_blog/2013/06/12/distilled-or-deionized-water-whats-the-difference/ Regular tap water has many ionic impurities and minerals which will react with the soldering iron tips
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling?con=t&page=26
packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling?con=t&page=42
packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling?con=t&page=35
packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling?con=t&page=1
packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling?con=t&page=32
packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
