PCB Libraries, Inc. | https://www.pcblibraries.com/forum/jedec-standard-footprints_topic2063_post8485.html
. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001. They do mention in Note 3 that there should be "Visible Wetting" but that's not possible with chips that do not have a terminal lead wraparound
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/jedec-standard-footprints_topic2063_post8485.html
. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001. They do mention in Note 3 that there should be "Visible Wetting" but that's not possible with chips that do not have a terminal lead wraparound
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/jedec-standard-footprints_topic2063.html
. Capacitors should have a side fillet and Resistors do not. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2063&OB=DESC.html
. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001. They do mention in Note 3 that there should be "Visible Wetting" but that's not possible with chips that do not have a terminal lead wraparound
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2063&OB=ASC.html
. Capacitors should have a side fillet and Resistors do not. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001
| https://www.eptac.com/blog/navigating-the-world-of-electronics-standards
IPC Certification How to Achieve Reliable Electronic Assemblies for Space Travel: J-STD-001 and Beyond Categories 3D electronics (2) automation (1) Blog (79) consumer electronics (2) Designer Certification (2) Electronics Manufacturing (13) EPTAC Team
| https://www.eptac.com/webinars/understanding-solderability-testing-for-printed-circuit-boards-and-components
FAQ’s About Us Instructors Consulting Services Customized Training Press Releases Careers Corporate Video Contact Webinars Understanding Solderability Testing for Printed Circuit Boards and Components J-STD-002
| https://www.eptac.com/webinars/understanding-solderability-testing-for-printed-circuit-boards-and-components/
FAQ’s About Us Instructors Consulting Services Customized Training Press Releases Careers Contact WEBINARS Understanding Solderability Testing for Printed Circuit Boards and Components J-STD-002
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/standards
. Document Name Source ESCC 25200 European Space Agency GEIA-STD-0006A SAE J-STD-020 IPC/JEDEC J-STD-033 IPC/JEDEC J-STD-035 IPC/JEDEC J-STD-075A IPC/JEDEC MIL-PRF-123 Defense Logistics Agency MIL-PRF
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_20_09.pdf
-466 IPC-TR-465-3 IPC-TR-465-2 IPC-TR-465-1 J-STD-002 5-23b 7 IPC-A-610, Acceptability of Electronic Assemblies This documents contains visual representations of what good solder joints look like in addition to assembly criteria, hardware installation, terminal connections, through hole and surface mount
